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fedl7533v-01 issue date: jun. 22, 2012 MSM7533V 2ch single rail codec general description the MSM7533V is two-channel codec cmos ics for voice signals ranging from 300 to 3400 hz. these devices contain filters for a/d and d/a conversion. designed especially for a single-power supply and lo w-power applications, these devices contain two-channel ad/da converters in a single chip and achieve a re duced footprint and a reduced number of external components. the MSM7533V is best suited for an analog interface to an echo canceller dsp used in digital telephone terminals, digital pabxs, and hands free terminals. features ? single power supply: +5 v ? power consumption operating mode: 35 mw typ. 74 mw max. v dd = 5 v power save mode: 7 mw typ. 16 mw max. v dd = 5 v power down mode: 0.05 mw typ. 0.3 mw max. v dd = 5 v ? itu-t companding law MSM7533V: /a-law pin selectable ? built-in pll eliminates a master clock ? the pcm interface can be switched between 2 channel serial/parallel ? transmission clock: 64/128/256/512/1024/2048 khz 96/192/384/768/1536/1544/200 khz (during 2 channel serial mode, the 64 and 96 khz clocks are disabled) ? adjustable transmit gain ? built-in reference voltage supply ? analog output can directly drive a 600 w line transformer ? package options: 20 - pin plastic skinny dip (dip20 - p - 300 - 2.54 - s1) /* dip pkg is end of life. 24-pin plastic sop (sop24-p-430-1.27-k) 1/ 20
fedl7533v-01 MSM7533V alaw 2/ 20
fedl7533v-01 MSM7533V alaw alaw /* dip pkg is end of life. 3/ 20
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fedl7533v-01 MSM7533V a-law -la w 7/ 20
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fedl7533v-01 MSM7533V /* dip pkg is end of life 17/ 20
fedl7533v-01 MSM7533V note s for mounting the surface mount type package the surface mount type packages ar e very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform refl ow mounting, contact rohm?s responsible sales person for the product name, package name, pin number, package co de and desired mounting conditions (reflow method, temperature and times). 18/ 20
fedl7533v-01 MSM7533V revision history page document no. date previous edition current edition description fedl7533v-01 jun. 21, 2012 ? ? final edition 19/ 20
fedl7533v-01 MSM7533V 20/20 notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of lapis semiconductor co., ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing lapis semiconductor's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from lapis semiconductor upon request. examples of application circuits, circuit constants an d any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the info rmation specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, lapis semiconductor shall bear no responsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. lapis semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or othe r rights held by lapis semiconductor and other parties. lapis semiconductor shall bear no responsibility whatso ever for any dispute arising from the use of such technical information. the products specified in this documen t are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). the products specified in this document are not designed to be radiation tolerant. while lapis semiconductor always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe desi gns. lapis semiconductor shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a me dical instrument, transpor tation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety devi ce). lapis semiconductor shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, pleas e contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law. copyright 2012 lapis semiconductor co., ltd.

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